IS25LP016D-JBLA1 vs W25Q16DVSNJG feature comparison

IS25LP016D-JBLA1 Integrated Silicon Solution Inc

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W25Q16DVSNJG Winbond Electronics Corp

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC WINBOND ELECTRONICS CORP
Package Description SOP, 0.150 INCH, GREEN, SOIC-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 133 MHz 80 MHz
JESD-30 Code S-PDSO-G8 R-PDSO-G8
Length 5.28 mm 4.9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 16777216 words
Number of Words Code 2000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 16MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 250
Programming Voltage 3 V 2.7 V
Screening Level AEC-Q100
Seated Height-Max 2.16 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 5.28 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-609 Code e3
Package Equivalence Code SOP8,.25
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.000025 A
Supply Current-Max 0.03 mA
Terminal Finish MATTE TIN
Write Protection HARDWARE/SOFTWARE

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Compare W25Q16DVSNJG with alternatives