IS25LP016D-JGLE1
vs
SST26VF016-80-5I-S2AE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TBGA,
|
0.200 INCH, ROHS COMPLIANT, SOIC-8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
133 MHz
|
80 MHz
|
| JESD-30 Code |
R-PBGA-B24
|
S-PDSO-G8
|
| Length |
8 mm
|
5.275 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
8
|
| Number of Words |
2097152 words
|
16777216 words
|
| Number of Words Code |
2000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2MX8
|
16MX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
SOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
3 V
|
|
| Seated Height-Max |
1.2 mm
|
2.16 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
6 mm
|
5.275 mm
|
| Base Number Matches |
1
|
4
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Factory Lead Time |
|
5 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Data Retention Time-Min |
|
100
|
| Endurance |
|
100000 Write/Erase Cycles
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Number of Ports |
|
1
|
| Package Equivalence Code |
|
SOP8,.3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Serial Bus Type |
|
SPI
|
| Standby Current-Max |
|
0.000015 A
|
| Supply Current-Max |
|
0.03 mA
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Type |
|
NOR TYPE
|
| Write Protection |
|
SOFTWARE
|
|
|
|
Compare IS25LP016D-JGLE1 with alternatives
Compare SST26VF016-80-5I-S2AE with alternatives