IS25LP016D-JNLA1 vs IS25LQ016B-JGLV feature comparison

IS25LP016D-JNLA1 Integrated Silicon Solution Inc

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IS25LQ016B-JGLV Integrated Silicon Solution Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description SOP, TBGA,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 133 MHz 104 MHz
JESD-30 Code R-PDSO-G8 R-PBGA-B24
Length 4.9 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 24
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 250
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 3.9 mm 6 mm
Base Number Matches 1 1
Endurance 100000 Write/Erase Cycles
Package Equivalence Code BGA24,4X6,40
Serial Bus Type QSPI
Write Protection HARDWARE/SOFTWARE

Compare IS25LP016D-JNLA1 with alternatives

Compare IS25LQ016B-JGLV with alternatives