IS25LP016D-RGLA1 vs W25Q16DVSNJG feature comparison

IS25LP016D-RGLA1 Integrated Silicon Solution Inc

Buy Now Datasheet

W25Q16DVSNJG Winbond Electronics Corp

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC WINBOND ELECTRONICS CORP
Package Description TBGA, 0.150 INCH, GREEN, SOIC-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 133 MHz 80 MHz
JESD-30 Code R-PBGA-B24 R-PDSO-G8
Length 8 mm 4.9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 1
Number of Functions 1 1
Number of Terminals 24 8
Number of Words 2097152 words 16777216 words
Number of Words Code 2000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 16MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Width 6 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-609 Code e3
Package Equivalence Code SOP8,.25
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.000025 A
Supply Current-Max 0.03 mA
Terminal Finish MATTE TIN
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare IS25LP016D-RGLA1 with alternatives

Compare W25Q16DVSNJG with alternatives