IS25LQ016B-JFLA1 vs IS25LQ016B-JGLV feature comparison

IS25LQ016B-JFLA1 Integrated Silicon Solution Inc

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IS25LQ016B-JGLV Integrated Silicon Solution Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description VSOP, TBGA,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 R-PBGA-B24
Length 5.28 mm 8 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 24
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSOP TBGA
Package Equivalence Code BGA24,4X6,40 BGA24,4X6,40
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 1 mm 1.2 mm
Serial Bus Type QSPI QSPI
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 5.28 mm 6 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1

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