IS25LQ016B-JHLE1 vs IS25LQ016B-JBLA1 feature comparison

IS25LQ016B-JHLE1 Integrated Silicon Solution Inc

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IS25LQ016B-JBLA1 Integrated Silicon Solution Inc

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TBGA, SOP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24 S-PDSO-G8
Length 8 mm 5.28 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA SOP
Package Equivalence Code BGA24,4X6,40 SOP8,.3
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 250
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 2.16 mm
Serial Bus Type QSPI QSPI
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Type NOR TYPE NOR TYPE
Width 6 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Screening Level AEC-Q100

Compare IS25LQ016B-JHLE1 with alternatives

Compare IS25LQ016B-JBLA1 with alternatives