IS43TR82560CL-15HBL-TR vs IS43TR82560C-15HBLI-TR feature comparison

IS43TR82560CL-15HBL-TR Integrated Silicon Solution Inc

Buy Now Datasheet

IS43TR82560C-15HBLI-TR Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TFBGA, TFBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Factory Lead Time 8 Weeks 8 Weeks
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B78 R-PBGA-B78
Length 10.5 mm 10.5 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type DDR3L DRAM DDR3 DRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 78 78
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 95 °C 95 °C
Operating Temperature-Min -40 °C
Organization 256MX8 256MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.45 V 1.575 V
Supply Voltage-Min (Vsup) 1.283 V 1.425 V
Supply Voltage-Nom (Vsup) 1.35 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 1 1

Compare IS43TR82560CL-15HBL-TR with alternatives

Compare IS43TR82560C-15HBLI-TR with alternatives