IS61DDPB22M36A1-400M3LI
vs
CY7C2565KV18-400BZXC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
LBGA, BGA165,11X15,40
|
13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
0.45 ns
|
0.45 ns
|
| Clock Frequency-Max (fCLK) |
400 MHz
|
400 MHz
|
| I/O Type |
COMMON
|
SEPARATE
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| Length |
17 mm
|
15 mm
|
| Memory Density |
75497472 bit
|
75497472 bit
|
| Memory IC Type |
DDR SRAM
|
QDR SRAM
|
| Memory Width |
36
|
36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
2MX36
|
2MX36
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA165,11X15,40
|
BGA165,11X15,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Standby Current-Max |
0.32 A
|
0.32 A
|
| Standby Voltage-Min |
1.7 V
|
1.7 V
|
| Supply Current-Max |
0.8 mA
|
1 mA
|
| Supply Voltage-Max (Vsup) |
1.89 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.71 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
15 mm
|
13 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
165
|
| Additional Feature |
|
PIPELINED ARCHITECTURE
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare IS61DDPB22M36A1-400M3LI with alternatives
Compare CY7C2565KV18-400BZXC with alternatives