Datasheets
IS61DDPB22M36A1-400M3LI by: Integrated Silicon Solution Inc

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165

Part Details for IS61DDPB22M36A1-400M3LI by Integrated Silicon Solution Inc

Overview of IS61DDPB22M36A1-400M3LI by Integrated Silicon Solution Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for IS61DDPB22M36A1-400M3LI

Part # Distributor Description Stock Price Buy
DISTI # IS61DDPB22M36A1-400M3LI
Avnet Asia SRAM Chip Sync Single Port 1.8V 72Mbit 2M X 36bit 0.45ns 165-Pin LFBGA (Alt: IS61DDPB22M36A1-400M3LI) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 14 Weeks, 0 Days 0
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Part Details for IS61DDPB22M36A1-400M3LI

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IS61DDPB22M36A1-400M3LI Part Data Attributes:

IS61DDPB22M36A1-400M3LI Integrated Silicon Solution Inc
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IS61DDPB22M36A1-400M3LI Integrated Silicon Solution Inc DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description LBGA, BGA165,11X15,40
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.32 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.8 mA
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for IS61DDPB22M36A1-400M3LI

This table gives cross-reference parts and alternative options found for IS61DDPB22M36A1-400M3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61DDPB22M36A1-400M3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS61DDPB22M36A-400M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A1-400M3LI vs IS61DDPB22M36A-400M3LI
IS61DDPB22M36A1-400M3I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A1-400M3LI vs IS61DDPB22M36A1-400M3I
IS61DDPB22M36A2-400M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A1-400M3LI vs IS61DDPB22M36A2-400M3LI
Part Number Description Manufacturer Compare
IS61QDP2B42M36A1-300M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A1-400M3LI vs IS61QDP2B42M36A1-300M3L
CY7C2565KV18-400BZXC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor IS61DDPB22M36A1-400M3LI vs CY7C2565KV18-400BZXC
GS8662Q36BGD-357IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A1-400M3LI vs GS8662Q36BGD-357IT
IS61QDP2B42M36A1-333M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A1-400M3LI vs IS61QDP2B42M36A1-333M3L
GS8662D36BD-400I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDPB22M36A1-400M3LI vs GS8662D36BD-400I
GS8662Q37BGD-357I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A1-400M3LI vs GS8662Q37BGD-357I
CY7C1565KV18-450BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor IS61DDPB22M36A1-400M3LI vs CY7C1565KV18-450BZXI
GS8662Q37BGD-357T DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A1-400M3LI vs GS8662Q37BGD-357T
GS8662Q37BD-357 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDPB22M36A1-400M3LI vs GS8662Q37BD-357
IS61QDP2B42M36A-400M3 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A1-400M3LI vs IS61QDP2B42M36A-400M3

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