IS61LF25618A-6.5B2I
vs
AS7C33128NTD36A-200BC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
BGA, BGA119,7X17,50
LQFP,
Pin Count
119
100
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
JESD-609 Code
e0
Length
22 mm
Memory Density
4718592 bit
Memory IC Type
CACHE SRAM
Memory Width
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
119
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.41 mm
Standby Current-Max
0.035 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.18 mA
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
14 mm
Base Number Matches
2
1
Compare IS61LF25618A-6.5B2I with alternatives
Compare AS7C33128NTD36A-200BC with alternatives