IS64LF12836A-7.5B3LA3
vs
IS61VF25618A-7.5B2
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
TBGA, BGA165,11X15,40
|
BGA, BGA119,7X17,50
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
10 Weeks
|
|
| Samacsys Manufacturer |
Integrated Silicon Solution Inc.
|
|
| Access Time-Max |
7.5 ns
|
7.5 ns
|
| Clock Frequency-Max (fCLK) |
117 MHz
|
117 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B119
|
| Length |
15 mm
|
22 mm
|
| Memory Density |
4718592 bit
|
4718592 bit
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
36
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
119
|
| Number of Words |
131072 words
|
262144 words
|
| Number of Words Code |
128000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX36
|
256KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
BGA
|
| Package Equivalence Code |
BGA165,11X15,40
|
BGA119,7X17,50
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.2 mm
|
2.41 mm
|
| Standby Current-Max |
0.045 A
|
0.03 A
|
| Standby Voltage-Min |
3.14 V
|
2.38 V
|
| Supply Current-Max |
0.175 mA
|
0.155 mA
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
2.75 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
14 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
119
|
| Additional Feature |
|
FLOW-THROUGH ARCHITECTURE
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare IS64LF12836A-7.5B3LA3 with alternatives
Compare IS61VF25618A-7.5B2 with alternatives