JAN1N5294UR-1
vs
JANHCA1N5294
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
DO-213AB
|
DIE
|
| Package Description |
HERMETIC SEALED, GLASS, LL41, MELF-2
|
HERMETIC SEALED, DIE-2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.40
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JEDEC-95 Code |
DO-213AB
|
|
| JESD-30 Code |
O-LELF-R2
|
S-XXUC-N2
|
| JESD-609 Code |
e0
|
e0
|
| Limiting Voltage-Max |
1.2 V
|
1.2 V
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
SQUARE
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Power Dissipation-Max |
0.5 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500
|
MIL-19500/463G
|
| Regulation Current-Nom (Ireg) |
0.75 mA
|
0.75 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WRAP AROUND
|
NO LEAD
|
| Terminal Position |
END
|
UNSPECIFIED
|
| Base Number Matches |
8
|
4
|
|
|
|
Compare JAN1N5294UR-1 with alternatives
Compare JANHCA1N5294 with alternatives