JAN1N5314-1
vs
1N5314
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
DO-35, 2 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JEDEC-95 Code |
DO-7
|
DO-35
|
| JESD-30 Code |
O-XALF-W2
|
O-XALF-W2
|
| Limiting Voltage-Max |
2.9 V
|
2.9 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/463G
|
|
| Regulation Current-Nom (Ireg) |
4.7 mA
|
4.7 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
1
|
20
|
| Rohs Code |
|
No
|
| Factory Lead Time |
|
21 Weeks
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| JESD-609 Code |
|
e0
|
| Knee Impedance-Max |
|
12000 Ω
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare JAN1N5314-1 with alternatives
Compare 1N5314 with alternatives