JAN1N6152
vs
JANS1N6152
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SEMTECH CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
HIGH RELIABILITY
|
METALLURGICALLY BONDED
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
O-LALF-W2
|
O-XALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Peak Rev Power Dis-Max |
1500 W
|
1500 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
BIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
3 W
|
7.5 W
|
| Qualification Status |
Qualified
|
Qualified
|
| Reference Standard |
MIL-19500
|
MIL-19500/516
|
| Rep Pk Reverse Voltage-Max |
20.6 V
|
20.6 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
AVALANCHE
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
6
|
5
|
| Package Description |
|
HERMETIC SEALED PACKAGE-2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Breakdown Voltage-Min |
|
24.3 V
|
| Breakdown Voltage-Nom |
|
27 V
|
| Clamping Voltage-Max |
|
39.2 V
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare JAN1N6152 with alternatives
Compare JANS1N6152 with alternatives