JANHCA1N5314
vs
CR470
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEMIC SEMICONDUCTORS
|
| Package Description |
HERMETIC SEALED, DIE-2
|
TO-206AA, 3 PIN
|
| Reach Compliance Code |
compliant
|
unknown
|
| Case Connection |
CATHODE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
| JESD-30 Code |
S-XXUC-N2
|
O-MBCY-W3
|
| JESD-609 Code |
e0
|
|
| Limiting Voltage-Max |
2.9 V
|
2.9 V
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| Package Body Material |
UNSPECIFIED
|
METAL
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
CYLINDRICAL
|
| Power Dissipation-Max |
0.5 W
|
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500/463G
|
|
| Regulation Current-Nom (Ireg) |
4.7 mA
|
4.7 mA
|
| Rep Pk Reverse Voltage-Max |
100 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
FIELD EFFECT
|
FIELD EFFECT
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UNSPECIFIED
|
BOTTOM
|
| Base Number Matches |
4
|
6
|
| JEDEC-95 Code |
|
TO-206AA
|
|
|
|
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