JANKC1N5313 vs JAN1N5313 feature comparison

JANKC1N5313 Microsemi Corporation

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JAN1N5313 Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Part Package Code DIE
Package Description DIE-1 O-LALF-W2
Pin Count 1
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.40 8541.10.00.70
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type CURRENT REGULATOR DIODE CURRENT REGULATOR DIODE
JESD-30 Code S-XUUC-N1 O-LALF-W2
JESD-609 Code e0
Limiting Voltage-Max 2.75 V 2.75 V
Number of Elements 1 1
Number of Terminals 1 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/463
Regulation Current-Nom (Ireg) 4.3 mA 4.3 mA
Rep Pk Reverse Voltage-Max 100 V 100 V
Surface Mount YES NO
Technology FIELD EFFECT FIELD EFFECT
Terminal Finish TIN LEAD
Terminal Form NO LEAD WIRE
Terminal Position UPPER AXIAL
Base Number Matches 2 6
Case Connection ISOLATED
JEDEC-95 Code DO-204AA
Knee Impedance-Max 14000 Ω
Operating Temperature-Max 200 °C
Operating Temperature-Min -55 °C
Power Dissipation-Max 0.6 W

Compare JANKC1N5313 with alternatives

Compare JAN1N5313 with alternatives