JANTX1N5303
vs
JANHC1N5303
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Part Package Code |
DO-7
|
DIE
|
Package Description |
O-LALF-W2
|
DIE-1
|
Pin Count |
2
|
1
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.70
|
8541.10.00.40
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
Dynamic Impedance-Min |
475000 Ω
|
|
JEDEC-95 Code |
DO-204AA
|
|
JESD-30 Code |
O-LALF-W2
|
S-XUUC-N1
|
JESD-609 Code |
e0
|
e0
|
Limiting Voltage-Max |
1.65 V
|
1.65 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
1
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Power Dissipation-Max |
0.6 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulation Current-Nom (Ireg) |
1.6 mA
|
1.6 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
NO
|
YES
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Base Number Matches |
5
|
1
|
Reference Standard |
|
MIL-19500/463
|
|
|
|
Compare JANTX1N5303 with alternatives
Compare JANHC1N5303 with alternatives