K4D623237A-QC60
vs
HY5DU643222AQ-55
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SK HYNIX INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
20 X 14 MM, 0.65 MM PITCH, TQFP-100
|
LQFP, QFP100,.63X.87
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
5.5 ns
|
0.9 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| Clock Frequency-Max (fCLK) |
166 MHz
|
183 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| Interleaved Burst Length |
2,4,8
|
2,4,8
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
20 mm
|
20 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
DDR1 DRAM
|
DDR1 DRAM
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
65 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
2MX32
|
2MX32
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
LQFP
|
| Package Equivalence Code |
TQFP100,.7X.9
|
QFP100,.63X.87
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.6 mm
|
| Self Refresh |
YES
|
YES
|
| Sequential Burst Length |
2,4,8,FP
|
2,4,8
|
| Standby Current-Max |
0.003 A
|
|
| Supply Current-Max |
0.34 mA
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare K4D623237A-QC60 with alternatives
Compare HY5DU643222AQ-55 with alternatives