K5A3340YBC-T7550 vs AM41DL3244GB85IS feature comparison

K5A3340YBC-T7550 Samsung Semiconductor

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AM41DL3244GB85IS AMD

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description TFBGA, LFBGA, BGA73,10X12,32
Pin Count 69 73
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 512K X 8 / 256K X 16; NOR FLASH CAN ALSO BE ORGANIZED AS 4M X 8 STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8
JESD-30 Code R-PBGA-B69 R-PBGA-B73
Length 11 mm 11.6 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 69 73
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 2
Rohs Code No
Access Time-Max 85 ns
JESD-609 Code e0
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA73,10X12,32
Supply Current-Max 0.045 mA
Terminal Finish Tin/Lead (Sn/Pb)

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