K6F1016S4M-TB120 vs AS7C181024LL-35BI feature comparison

K6F1016S4M-TB120 Samsung Semiconductor

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AS7C181024LL-35BI Alliance Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ALLIANCE SEMICONDUCTOR CORP
Part Package Code TSOP2 BGA
Package Description TSOP2, BGA, BGA36,6X8,30
Pin Count 44 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns 35 ns
JESD-30 Code R-PDSO-G44 R-PBGA-B48
Length 18.41 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64KX16 128KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V 1.95 V
Supply Voltage-Min (Vsup) 2.3 V 1.65 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position DUAL BOTTOM
Width 10.16 mm
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA36,6X8,30
Standby Current-Max 4e-7 A
Standby Voltage-Min 1.2 V
Supply Current-Max 0.025 mA
Terminal Finish TIN LEAD

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Compare AS7C181024LL-35BI with alternatives