K9F1G08U0D-SIB00 vs K9F1G08U0D-SCB00 feature comparison

K9F1G08U0D-SIB00 Samsung Semiconductor

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K9F1G08U0D-SCB00 Samsung Semiconductor

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1 TSOP1
Package Description 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature CONTAINS ADDITIONAL 32M BIT NAND FLASH CONTAINS ADDITIONAL 32M BIT NAND FLASH
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Pbfree Code Yes
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 10

Compare K9F1G08U0D-SIB00 with alternatives

Compare K9F1G08U0D-SCB00 with alternatives