KS24A641IS vs XC17128EVOG8I feature comparison

KS24A641IS Samsung Semiconductor

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XC17128EVOG8I AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC XILINX INC
Part Package Code SOIC TSOP
Package Description SOP, TSOP2,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.92 mm 4.9276 mm
Memory Density 65536 bit 131072 bit
Memory IC Type EEPROM CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX1 128KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.95 mm 1.1938 mm
Serial Bus Type I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 4.5 V
Supply Voltage-Nom (Vsup) 2 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.95 mm 3.937 mm
Write Cycle Time-Max (tWC) 5 ms
Base Number Matches 2 1
Rohs Code Yes
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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