KS82C54-10CP vs MD82C54-10/B feature comparison

KS82C54-10CP Samsung Semiconductor

Buy Now Datasheet

MD82C54-10/B Intersil Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTERSIL CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 24 24
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Bus Compatibility 8080; 8085; 8086; 8088; 80286; 80386; 68000
External Data Bus Width 8 8
Information Access Method PARALLEL, DIRECT ADDRESS PARALLEL, DIRECT ADDRESS
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.75 mm
Number of Bits 16 16
Number of Terminals 24 24
Number of Timers 3 3
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.72 mm
Supply Current-Max 20 mA
Supply Voltage-Max 6 V 5.5 V
Supply Voltage-Min 4 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type TIMER, PROGRAMMABLE TIMER, PROGRAMMABLE
Base Number Matches 1 2
Clock Frequency-Max 0.032 MHz

Compare KS82C54-10CP with alternatives

Compare MD82C54-10/B with alternatives