KSH122-TF vs MJD122-TP-HF feature comparison

KSH122-TF Samsung Semiconductor

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MJD122-TP-HF Micro Commercial Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRO COMMERCIAL COMPONENTS CORP
Package Description SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.95
Collector Current-Max (IC) 8 A 8 A
Collector-Base Capacitance-Max 200 pF 200 pF
Collector-Emitter Voltage-Max 100 V 100 V
Configuration DARLINGTON WITH BUILT-IN DIODE AND RESISTOR DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 100 100
JESD-30 Code R-PSSO-G2 R-PSSO-G2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 20 W 1.5 W
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Transistor Element Material SILICON SILICON
VCEsat-Max 4 V 4 V
Base Number Matches 1 1
Rohs Code Yes
Case Connection COLLECTOR
JEDEC-95 Code TO-252
Moisture Sensitivity Level 1
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 1.5 W
Time@Peak Reflow Temperature-Max (s) 10

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