L9952GXP
vs
L9952GXPTR
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
ROHS COMPLIANT, SSO-36
|
ROHS COMPLIANT, SSO-36
|
| Pin Count |
36
|
36
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G36
|
R-PDSO-G36
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10.3 mm
|
10.3 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
HSSOP
|
| Package Equivalence Code |
SSOP36,.4,20
|
SSOP36,.4,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.47 mm
|
2.47 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
13.5 V
|
13.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
52 Weeks
|
|
|
|