LE79R79-2DJC
vs
LE79R79-2QC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
LEGERITY INC
|
Package Description |
QCCJ,
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
7 Weeks
|
|
Battery Feed |
CONSTANT CURRENT
|
|
Battery Supply |
-40.5 TO -75 V
|
|
Hybrid |
2-4 CONVERSION
|
|
JESD-30 Code |
R-PQCC-J32
|
S-XQCC-N32
|
JESD-609 Code |
e3
|
|
Length |
13.97 mm
|
8 mm
|
Noise-Max |
12 dBrnC
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
PSRR-Min |
30 dB
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
QCCJ
|
HVQCCN
|
Package Equivalence Code |
LDCC32,.5X.6
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
3.556 mm
|
1 mm
|
Supply Current-Max |
9 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.43 mm
|
8 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
QFN
|
Pin Count |
|
32
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LE79R79-2DJC with alternatives
Compare LE79R79-2QC with alternatives