LFXP2-8E-6MN132C
vs
LFXP2-8E-7MN132C
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Lattice Semiconductor
|
|
| Clock Frequency-Max |
435 MHz
|
435 MHz
|
| Combinatorial Delay of a CLB-Max |
0.399 ns
|
0.304 ns
|
| JESD-30 Code |
S-PBGA-B132
|
S-PBGA-B132
|
| JESD-609 Code |
e1
|
e1
|
| Length |
8 mm
|
8 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1000
|
1000
|
| Number of Inputs |
86
|
86
|
| Number of Logic Cells |
8000
|
8000
|
| Number of Outputs |
86
|
86
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA132,14X14,20
|
BGA132,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.35 mm
|
1.35 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LFXP2-8E-6MN132C with alternatives
Compare LFXP2-8E-7MN132C with alternatives