LM358H/NOPB vs LMC6032MWA feature comparison

LM358H/NOPB National Semiconductor Corporation

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LMC6032MWA National Semiconductor Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code BCY WAFER
Package Description METAL CAN, TO-5, 8 PIN DIE, WAFER
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.05 µA
Bias Current-Max (IIB) @25C 0.25 µA
Common-mode Reject Ratio-Min 65 dB
Common-mode Reject Ratio-Nom 85 dB 83 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code O-MBCY-W8 X-XUUC-N
JESD-609 Code e1
Low-Offset NO NO
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 2 2
Number of Terminals 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material METAL UNSPECIFIED
Package Code TO-5 DIE
Package Equivalence Code CAN8,.2 WAFER
Package Shape ROUND UNSPECIFIED
Package Style CYLINDRICAL UNCASED CHIP
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 0.1 V/us 1.1 V/us
Supply Current-Max 2 mA 1.9 mA
Supply Voltage Limit-Max 32 V 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form WIRE NO LEAD
Terminal Position BOTTOM UPPER
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 1000 1400
Voltage Gain-Min 25000 20000
Base Number Matches 1 1
Low-Bias YES
Micropower YES
Slew Rate-Min 0.4 V/us

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