LM3S1635-IBZ50-A2T vs LM3S2739-IBZ50-A2 feature comparison

LM3S1635-IBZ50-A2T Texas Instruments

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LM3S2739-IBZ50-A2 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description GREEN, MO-219F, BGA-108 GREEN, MO-219F, BGA-108
Pin Count 108 108
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 0.032 MHz 0.032 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PBGA-B108 S-PBGA-B108
JESD-609 Code e1 e1
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 56 56
Number of Terminals 108 108
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA108,12X12,32 BGA108,12X12,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 32768 65536
ROM (words) 131072 131072
ROM Programmability FLASH FLASH
Seated Height-Max 1.5 mm 1.5 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 2

Compare LM3S1635-IBZ50-A2T with alternatives

Compare LM3S2739-IBZ50-A2 with alternatives