LM75BD vs DS75U/T&R feature comparison

LM75BD NXP Semiconductors

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DS75U/T&R Maxim Integrated Products

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MAXIM INTEGRATED PRODUCTS INC
Package Description 3.9MM, PLASTIC, SOP -8 TSSOP8,.19
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Accuracy-Max (Cel) 3 Cel 2 Cel
Body Breadth 3.9 mm 3 mm
Body Height 1.75 mm 1.1 mm
Body Length or Diameter 4.9 mm 3 mm
Housing PLASTIC PLASTIC
JESD-609 Code e4 e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Bits 11 12
Number of Terminals 8 8
Operating Current-Max 5 mA 1 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Interface Type 2-WIRE INTERFACE 2-WIRE INTERFACE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code SOP8,.25 TSSOP8,.19
Package Shape/Style RECTANGULAR SQUARE
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.8 V 2.7 V
Surface Mount YES YES
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Tin/Lead (Sn/Pb)
Termination Type SOLDER SOLDER
Base Number Matches 1 1
Pbfree Code No
ECCN Code EAR99
Technology CMOS

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