LTC2309CF#PBF vs LTC2309CUF#PBF feature comparison

LTC2309CF#PBF Linear Technology

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LTC2309CUF#PBF Linear Technology

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP LINEAR TECHNOLOGY CORP
Part Package Code TSSOP QFN
Package Description 4.40 MM, LEAD FREE, PLASTIC, TSSOP-20 4 X 4 MM, LEAD FREE, PLASTIC, MO-220WGGD, QFN-24
Pin Count 20 24
Manufacturer Package Code F UF
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog Input Voltage-Max 2.048 V 2.048 V
Analog Input Voltage-Min -2.048 V -2.048 V
Conversion Time-Max 1.8 µs 1.8 µs
Converter Type ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
JESD-30 Code R-PDSO-G20 S-PQCC-N24
JESD-609 Code e3 e3
Length 6.5 mm 4 mm
Linearity Error-Max (EL) 0.0244% 0.0244%
Moisture Sensitivity Level 1 1
Number of Analog In Channels 8 8
Number of Bits 12 12
Number of Functions 1 1
Number of Terminals 20 24
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Bit Code BINARY, 2'S COMPLEMENT BINARY BINARY, 2'S COMPLEMENT BINARY
Output Format SERIAL SERIAL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP20,.25 LCC24,.16SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Sample Rate 0.014 MHz 0.014 MHz
Sample and Hold / Track and Hold SAMPLE SAMPLE
Seated Height-Max 1.1 mm 0.8 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 4 mm
Base Number Matches 2 2

Compare LTC2309CF#PBF with alternatives

Compare LTC2309CUF#PBF with alternatives