LTC2909CDDB-3.3#TRMPBF
vs
LTC2909IDDB-3.3#TRMPBF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
ANALOG DEVICES INC
|
| Part Package Code |
DFN
|
|
| Package Description |
3 X 2 MM, LEAD FREE, PLASTIC, MO-229WECD-1, DFN-8
|
3 X 2 MM, LEAD FREE, PLASTIC, MO-229WECD-1, DFN-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
DDB
|
05-08-1702
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Min (Vsup) |
0.5 V
|
0.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare LTC2909CDDB-3.3#TRMPBF with alternatives
Compare LTC2909IDDB-3.3#TRMPBF with alternatives