LTC2975IY#PBF
vs
LTC2975IUP#PBF
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Package Description |
BGA-63
|
QFN-64
|
| Pin Count |
63
|
64
|
| Manufacturer Package Code |
05-08-1547
|
05-08-1705
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2020-02-18
|
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PBGA-B63
|
S-PQCC-N64
|
| JESD-609 Code |
e1
|
e3
|
| Length |
7.5 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
63
|
64
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Seated Height-Max |
1.72 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
6.25 mm
|
9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare LTC2975IY#PBF with alternatives
Compare LTC2975IUP#PBF with alternatives