M24C01-WBN3TG/G vs 24C01BPA feature comparison

M24C01-WBN3TG/G STMicroelectronics

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24C01BPA Catalyst Semiconductor

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS CATALYST SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3
Length 9.27 mm 9.27 mm
Memory Density 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 4.57 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1

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