M24C04-WBN6T vs M24C04-WBN3/G feature comparison

M24C04-WBN6T STMicroelectronics

Buy Now Datasheet

M24C04-WBN3/G STMicroelectronics

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz 0.4 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e3
Length 9.27 mm 9.27 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 512X8
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 5.33 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 4 5
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare M24C04-WBN6T with alternatives

Compare M24C04-WBN3/G with alternatives