M24C16-FCS6TP/S
vs
M24C16-FCS5P
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Package Description |
,
|
VFBGA, BGA5,3X3,14/8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Serial Bus Type |
I2C
|
I2C
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Clock Frequency-Max (fCLK) |
|
0.4 MHz
|
| Data Retention Time-Min |
|
40
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| I2C Control Byte |
|
1010MMMR
|
| JESD-30 Code |
|
R-PBGA-B5
|
| Length |
|
1.255 mm
|
| Memory Density |
|
16384 bit
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
5
|
| Number of Words |
|
2048 words
|
| Number of Words Code |
|
2000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Organization |
|
2KX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VFBGA
|
| Package Equivalence Code |
|
BGA5,3X3,14/8
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
|
SERIAL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.6 mm
|
| Standby Current-Max |
|
0.000001 A
|
| Supply Current-Max |
|
0.0008 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.7 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.346 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
1.21 mm
|
| Write Cycle Time-Max (tWC) |
|
5 ms
|
| Write Protection |
|
HARDWARE
|
|
|
|
Compare M24C16-FCS6TP/S with alternatives
Compare M24C16-FCS5P with alternatives