M24C64-WDW6B vs M24C64-WDW3/B feature comparison

M24C64-WDW6B STMicroelectronics

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M24C64-WDW3/B STMicroelectronics

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description TSSOP, 0.169 INCH, TSSOP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
Clock Frequency-Max (fCLK) 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Length 4.4 mm 4.4 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Serial Bus Type I2C
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm 3 mm
Write Cycle Time-Max (tWC) 5 ms
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Screening Level AEC-Q100
Supply Current-Max 0.005 mA
Technology CMOS

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