M25P64-VME3GB
vs
W25Q64CVZEJP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DFP
|
|
| Package Description |
SON,
|
HVSON,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
75 MHz
|
80 MHz
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-N8
|
| Length |
10.3 mm
|
8 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8MX8
|
8MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SON
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Programming Voltage |
2.7 V
|
3 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
|
| Width |
7.5 mm
|
6 mm
|
| Base Number Matches |
2
|
1
|
| Samacsys Manufacturer |
|
Winbond
|
| Output Characteristics |
|
3-STATE
|
| Screening Level |
|
AEC-Q100
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
|
|
|
Compare M25P64-VME3GB with alternatives
Compare W25Q64CVZEJP with alternatives