M25PX64-VME3T
vs
W25Q64JVZEJM
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
WINBOND ELECTRONICS CORP
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Memory IC Type |
FLASH
|
FLASH
|
Programming Voltage |
2.7 V
|
3 V
|
Base Number Matches |
6
|
2
|
Rohs Code |
|
Yes
|
Package Description |
|
WSON-8
|
Date Of Intro |
|
2018-04-03
|
Samacsys Manufacturer |
|
Winbond
|
Additional Feature |
|
IT ALSO OPERATES AT 2.7V @ 104MHZ
|
Alternate Memory Width |
|
1
|
Clock Frequency-Max (fCLK) |
|
133 MHz
|
Data Retention Time-Min |
|
20
|
Endurance |
|
100000 Write/Erase Cycles
|
JESD-30 Code |
|
R-PDSO-N8
|
Length |
|
8 mm
|
Memory Density |
|
67108864 bit
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
8
|
Number of Words |
|
8388608 words
|
Number of Words Code |
|
8000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
8MX8
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVSON
|
Package Equivalence Code |
|
SOLCC8,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Parallel/Serial |
|
SERIAL
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
0.8 mm
|
Serial Bus Type |
|
SPI
|
Standby Current-Max |
|
0.00005 A
|
Supply Current-Max |
|
0.025 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Type |
|
NOR TYPE
|
Width |
|
6 mm
|
Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare M25PX64-VME3T with alternatives
Compare W25Q64JVZEJM with alternatives