M25PX64-VMF6TA vs W25Q64JVTBJQ feature comparison

M25PX64-VMF6TA Micron Technology Inc

Buy Now Datasheet

W25Q64JVTBJQ Winbond Electronics Corp

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description SOP, TBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 133 MHz
JESD-30 Code R-PDSO-G16 R-PBGA-B24
Length 10.3 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 24
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 3 V
Seated Height-Max 2.65 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position DUAL BOTTOM
Width 7.5 mm 6 mm
Base Number Matches 1 2
Date Of Intro 2018-04-03
Samacsys Manufacturer Winbond
Additional Feature IT ALSO OPERATES AT 2.7V @ 104MHZ
Alternate Memory Width 1
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Output Characteristics 3-STATE
Package Equivalence Code BGA24,5X5,40
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare M25PX64-VMF6TA with alternatives

Compare W25Q64JVTBJQ with alternatives