M25PX64STVME6TP vs W25Q64FVDAIG feature comparison

M25PX64STVME6TP Micron Technology Inc

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W25Q64FVDAIG Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description SON, SOLCC8,.3 DIP-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 75 MHz 104 MHz
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8 R-PDIP-T8
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Terminals 8 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SON DIP
Package Equivalence Code SOLCC8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Serial Bus Type SPI SPI
Standby Current-Max 0.00001 A 0.00005 A
Supply Current-Max 0.015 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 2 1
Samacsys Manufacturer Winbond
Alternate Memory Width 1
Data Retention Time-Min 20
Length 9.27 mm
Number of Functions 1
Output Characteristics 3-STATE
Programming Voltage 3 V
Seated Height-Max 5.33 mm
Supply Voltage-Nom (Vsup) 3 V
Width 7.62 mm

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Compare W25Q64FVDAIG with alternatives