M25PX64SVME3EB
vs
W25X64VZEIG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
WINBOND ELECTRONICS CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Memory IC Type |
FLASH
|
FLASH
|
| Programming Voltage |
2.7 V
|
3 V
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SON
|
| Package Description |
|
HVSON, SOLCC8,.3
|
| Pin Count |
|
8
|
| Samacsys Manufacturer |
|
Winbond
|
| Clock Frequency-Max (fCLK) |
|
50 MHz
|
| Data Retention Time-Min |
|
20
|
| Endurance |
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
|
R-PDSO-N8
|
| Length |
|
8 mm
|
| Memory Density |
|
67108864 bit
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Number of Words |
|
8388608 words
|
| Number of Words Code |
|
8000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
8MX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVSON
|
| Package Equivalence Code |
|
SOLCC8,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
|
SERIAL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.8 mm
|
| Serial Bus Type |
|
SPI
|
| Standby Current-Max |
|
0.00001 A
|
| Supply Current-Max |
|
0.018 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Type |
|
NOR TYPE
|
| Width |
|
6 mm
|
| Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare M25PX64SVME3EB with alternatives
Compare W25X64VZEIG with alternatives