M2732AF1 vs HN482732AG-25 feature comparison

M2732AF1 STMicroelectronics

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HN482732AG-25 Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS RENESAS ELECTRONICS CORP
Part Package Code DIP DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-24 DIP,
Pin Count 24 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Samacsys Manufacturer STMicroelectronics
Access Time-Max 250 ns 250 ns
Additional Feature 21V PROGRAMMING VOLTAGE
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-PDIP-T24
JESD-609 Code e0
Length 31.75 mm
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX8 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 21 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.125 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1

Compare M2732AF1 with alternatives

Compare HN482732AG-25 with alternatives