Part Details for HN482732AG-25 by Renesas Electronics Corporation
Overview of HN482732AG-25 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Renewable Energy
Automotive
Robotics and Drones
Part Details for HN482732AG-25
HN482732AG-25 CAD Models
HN482732AG-25 Part Data Attributes
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HN482732AG-25
Renesas Electronics Corporation
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Datasheet
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HN482732AG-25
Renesas Electronics Corporation
4KX8 UVPROM, 250ns, PDIP24, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| Memory Density | 32768 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for HN482732AG-25
This table gives cross-reference parts and alternative options found for HN482732AG-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN482732AG-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC27C32BQE250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | HN482732AG-25 vs NMC27C32BQE250 |
| QD2732A | UVPROM, 4KX8, 250ns, NMOS, CDIP24, CERDIP-24 | Intel Corporation | HN482732AG-25 vs QD2732A |
| AM2732B-250DI | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | HN482732AG-25 vs AM2732B-250DI |
| AM2732B-250/BJA | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | HN482732AG-25 vs AM2732B-250/BJA |
| 8001203JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | AMD | HN482732AG-25 vs 8001203JX |
| 8001209JX | UVPROM, 4KX8, 250ns, NMOS, 1.290 X 0.610 INCH, 0.225 INCH HEIGHT, DIP-24 | AMD | HN482732AG-25 vs 8001209JX |
| NMC27C32BQ250 | IC 4K X 8 UVPROM, 250 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | HN482732AG-25 vs NMC27C32BQ250 |
| M2732AF6 | 4KX8 UVPROM, 250ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24 | STMicroelectronics | HN482732AG-25 vs M2732AF6 |
| TMS2732A-25JL | 4KX8 UVPROM, 250ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | Texas Instruments | HN482732AG-25 vs TMS2732A-25JL |
| AM2732B-250DE | UVPROM, 4KX8, 250ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | HN482732AG-25 vs AM2732B-250DE |