M28W160CB100N6
vs
M28W160ECB100N6
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
TSSOP, TSSOP48,.8,20
|
TSSOP, TSSOP48,.8,20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
100 ns
|
100 ns
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
NO
|
NO
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Sectors/Size |
8,31
|
8,31
|
| Number of Terminals |
48
|
48
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP48,.8,20
|
TSSOP48,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sector Size |
4K,32K
|
4K,32K
|
| Standby Current-Max |
0.000006 A
|
0.000005 A
|
| Supply Current-Max |
0.02 mA
|
0.02 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Toggle Bit |
NO
|
NO
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
3
|
3
|
|
|
|