M29DW640D90ZA1E vs AM29LV640DU90RWHFN feature comparison

M29DW640D90ZA1E Numonyx Memory Solutions

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AM29LV640DU90RWHFN Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX SPANSION INC
Part Package Code BGA BGA
Package Description 7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63 12 X 11 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Additional Feature BOTTOM BOOT BLOCK
Alternate Memory Width 8
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1 e1
Length 11 mm 12 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Type NOR TYPE NOR TYPE
Width 7 mm 11 mm
Base Number Matches 1 1
Rohs Code Yes
Moisture Sensitivity Level 3

Compare M29DW640D90ZA1E with alternatives

Compare AM29LV640DU90RWHFN with alternatives