M29F160FT55N6F2 vs M29F160FT55N6S2 feature comparison

M29F160FT55N6F2 Micron Technology Inc

Buy Now Datasheet

M29F160FT55N6S2 Micron Technology Inc

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description TSOP1, ,
Reach Compliance Code unknown unknown
Access Time-Max 55 ns
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48
Length 18.4 mm
Memory Density 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 48
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Screening Level AEC-Q100
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm
Base Number Matches 2 2

Compare M29F160FT55N6F2 with alternatives

Compare M29F160FT55N6S2 with alternatives