M29F800DB55N3E vs M29F800DT55N3E feature comparison

M29F800DB55N3E STMicroelectronics

Buy Now Datasheet

M29F800DT55N3E STMicroelectronics

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code TSOP TSOP
Package Description 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Additional Feature BOTTOM BOOT BLOCK TOP BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e3/e6
Length 18.4 mm 18.4 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN/TIN BISMUTH TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 2

Compare M29F800DB55N3E with alternatives

Compare M29F800DT55N3E with alternatives