M2GL005S-1VFG400T2
vs
M2GL005S-1VF400
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
16 Weeks
|
10 Weeks
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Packing Method |
TRAY
|
TRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Temperature Grade |
AUTOMOTIVE
|
OTHER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
17 X 17 MM, 0.80 MM PITCH, VFBGA-400
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
S-PBGA-B400
|
| Length |
|
17 mm
|
| Number of Inputs |
|
171
|
| Number of Logic Cells |
|
6060
|
| Number of Outputs |
|
171
|
| Number of Terminals |
|
400
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA400,20X20,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.51 mm
|
| Supply Voltage-Max |
|
1.26 V
|
| Supply Voltage-Min |
|
1.14 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
17 mm
|
|
|
|
Compare M2GL005S-1VFG400T2 with alternatives
Compare M2GL005S-1VF400 with alternatives