M38510/20403BEX vs M38510/20403BEA feature comparison

M38510/20403BEX Teledyne e2v

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M38510/20403BEA NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 250 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
Memory Density 16384 bit 4194304 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 2000 256000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX8 256KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.14 mA 0.02 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 4
Screening Level MIL-M-38510 Class B

Compare M38510/20403BEX with alternatives

Compare M38510/20403BEA with alternatives